Numéro de référence
ISO/TS 10303-1650:2014
Spécification technique
ISO/TS 10303-1650:2014
Systèmes d'automatisation industrielle et intégration — Représentation et échange de données de produits — Partie 1650: Module d'application: Matrice nue
Edition 3
2014-06
Annulée
ISO/TS 10303-1650:2014
64411
Annulée (Edition 3, 2014)

Résumé

ISO/TS 10303-1650:2014-02 specifies the application module for Bare die.

The following is within the scope of ISO/TS 10303-1650:2014-02:

The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.

  • definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.

Informations générales

  •  : Annulée
     : 2014-06
    : Annulation de la Norme internationale [95.99]
  •  : 3
  • ISO/TC 184/SC 4
    25.040.40 
  • RSS mises à jour

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