Reference number
ISO/TS 10303-1650:2018
Technical Specification
ISO/TS 10303-1650:2018
Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die
Edition 5
2018-11
Technical Specification
Preview
ISO/TS 10303-1650:2018
76219
недоступно на русском языке
Опубликовано (Версия 5, 2018)
Последний раз этот публикация был пересмотрен в  2022. Поэтому данная версия остается актуальной.

Тезис

ISO/TS 10303-1650:2018-11 specifies the application module for Bare die.

The following is within the scope of ISO/TS 10303-1650:2018-11:

The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.

  • definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.

Общая информация

  •  : Опубликовано
     : 2018-11
    : Подтверждение действия международного стандарта [90.93]
  •  : 5
  • ISO/TC 184/SC 4
    25.040.40 
  • RSS обновления

Добавить в корзину данный стандарт

This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

Жизненный цикл

Появились вопросы?

Ознакомьтесь с FAQ